Samsung Semiconductor RAM chip marking & reference


On chip top SEC KOREA 843
KM416S1020CT-G8
TPI132D3
KOREA
423Y
KM44C4100J-7
SAMSUNG 148
K4D26323RA-GC2B
WFHE17BX KOREA
SAMSUNG 226
K4H560838D-TCC4
BDE7226A KOREA

Samsung changed markings on the chip on 1st Jan 2000 to a new system.

Samsung Semiconductor RAM chip marking
SAMSUNG
SEC
www.intl.samsungsemi.com
www.sec.samsung.com
K4
KM
K4 - Samsung Memory
KM - Samsung Semiconductor
843 - date of manufacture 8 - year of manufacture (8 - 1998, 9 - 1999, ...)
43 - week of manufacture
4 - RAM type 23 - Mask ROM
29 - NAND-Flash
4 - DRAM
6 - Asynchronous SRAM
7 - Synchronous SRAM
16 - bit organization 1 - x1bit
4 - x4bit
8 - x8bit
9 - x9bit
16 - x16bit
32 - x32bit
V - voltage C - 5.0V
V - 3.3V
U - 3.0V
S - 2.5V
Q - 2.5V
R - 2.0V
17 - memory density 25 - 256KBit
51 - 512KBit
1 - 1MBit
4 - 4MBit
8 - 8MBit
16 - 16MBit
32 - 32MBit
64 - 64MBit
0 - refresh 0 - 1024 (4MD), 4096 (16MD), 8192 (64MD)
1 - 512 (4MD), 2048 (16MD), 4096 (64MD)
2 - 1024 (16MD)
5 - RAM type 0 - FP mode
1 - ?
2 - ?
3 - FP mode (quad CAS)
4 - EDO mode
5 - EDO mode (quad CAS)
C - die revision [none] - 1st generation
A - 2nd generation
B - 3rd generation
C, D, ...
SJ - package option J - SOJ
K - SOJ (shrinked package)
T - TSOP II
S - TSOP II (shrinked package)
C - CSP
E - Temperature [none] - normal range (0 to 70°C)
E - extended range (-25 to 85°C)
I - industrial range (-40 to 85°C)
E - power (DC current) [none] normal power
E - low power
G8 - min cycle time 4 - 40ns
45 - 45ns
5 - 50ns
55 - 55ns
6 - 60ns
7- 70ns
G8 - 8ns CAS2 PC100
10 - 10ns CAS3 PC66
GL - 10ns CAS3 PC100
GH - 10ns CAS2 PC100
TPI132D3 - Serialization code ?